FITOK Quick-Connects Help You Build Reliable Cooling Systems

12/19/2023

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Many devices in semiconductor manufacturing processes are temperature sensitive. For example, high-precision machines such as furnaces and CVDs need effective cooling circulation systems to maintain controlled temperatures. These circulation systems keep the entire facility running reliably for long periods by pumping a refrigerant. Quick-connects are typically used with cooling pipelines to enable quick coupling and uncoupling during maintenance. However, any potential dripping or seepage may cause machine downtime and disrupt the production schedule of an entire batch of wafers. Thus, selecting the right quick-connects is crucial for the stable operation of semiconductor cooling systems.

Quick-connects

How to Choose the Right Quick-Connects?

There are five important features to consider when selecting the right quick-connect for your cooling systems:

1. Optimal flow rate with low pressure drop. One of the most crucial factors is maintaining optimum flow in the cooling system. System components with the lowest possible pressure drop reduce pump energy consumption, contributing to cost savings.

2. Extremely low spillage and air inclusion. It’s highly recommended to always choose quick-connects with the lowest spillage and air inclusion for clean coupling and uncoupling. Quick-connects with extremely low spillage prevent media spillage from causing damage or malfunction to adjacent equipment and mitigate the risk of unplanned downtime.

3. Compact design. Limited space in semiconductor cooling systems requires quick-connects to be compact in design and small in size.

4. Long term reliability. It’s a challenge to maintain the reliability of quick-connects left unused for long periods of time. Therefore, when selecting quick-connects, it’s crucial to work with a supplier that has extensive experience in quick connect solutions.

5. Compatible materials. Both the quick-connect body and sealing material must be compatible with the refrigerant to ensure long service life and leak-free operation.

FITOK Provides a Wide Range of Quick-Connects

As a professional supplier of fluid systems for the semiconductor industry, FITOK provides a wide variety of quick-connects. FITOK ensures the sealing and reliability of quick-connects through advanced design and manufacturing processes, as well as strict quality control. Suitable for a wide range of cooling systems and compatible with a variety of cooling media, FITOK quick-connects are widely used in semiconductor, automotive manufacturing, energy storage power plants, information technology, and other fields.

Flat Face Quick-Connects QP Series

QP series quick-connects are a star product among FITOK cooling system solutions. Compatible with most fluids such as water glycol, heat transfer oil, cooling water, etc., these quick-connects are widely used in cooling systems in electronics, photovoltaic, information technology, and other industries.

Features

Small size, compact design, and high flow rate to allow for rapid flow of refrigerant
A variety of O-ring sealing materials optional to offer extensive working temperature coverage and compatibility with most fluids
FITOK tailor-made O-ring material to present high compatibility with a high concentration of ethylene glycol
Flat head design to reduce air inclusion or spillage during coupling or uncoupling

Technical Parameters


Body Material		Stainless Steel or Aluminum Alloy
Max. Working Pressure		290 psig (20 bar)
Working Temperature	FKM	-4°F to 392°F (-20°C to 200°C)
	FFKM	-4°F to 527°F (-20°C to 275°C)
	NBR	-22°F to 212°F (-30°C to 100°C)
	EPDM	-40°F to 300°F (-40°C to 148°C)
	FVMQ	-40°F to 347°F (-40°C to 175°C)
Flow Coefficient (Cv)^①	QP8	0.9
	QP10	4.1
	QP12	5.4

① The above Cv values are for stem-to-body flow and may decline depending on specifications of fittings configured.

Spillage and Air Inclusion


Series	Spillage cm³	Air Inclusion cm³
QP8	≤ 0.01	≤ 0.01
QP10	≤ 0.01	≤ 0.02
QP12	≤ 0.02	≤ 0.04

PTFE-Sealed Quick-Connects QTM Series

Compared with QP series quick-connects, the QTM series has a wider medium compatibility, making it a solution for ethylene glycol cooling systems.

Features

Wetted components in stainless steel and PTFE
PTFE seal ring
Extensive medium compatibility and applicable to ethylene glycol
Special design to reduce air inclusion and spillage
Single-end shutoff and double-end shutoff optional

Technical Parameters


Body Materials	316 SS or Alloy 400
Max. Working Pressure	4500 psig (310 bar)
Working Temperature	0°F to 212°F (-17°C to 100°C)

Spillage and Air Inclusion


Series	Spillage cm³	Air Inclusion cm³
QTM2	0.1	0.1
QTM4	0.2	0.4
QTM8	1.0	2.0

DESO only

In addition to the QP and QTM series star products, FITOK also provides QC, QF, QM, and QV series quick-connects for regular cooling pipelines, quick coupling and uncoupling, and other applications.

General Service Quick-Connects QC Series

Working pressure up to 3000 psig (207 bar)
Single-end shutoff, double-end shutoff and full-flow models available
Locking mechanism with large contact area to ensure reliable stem retainment
Reliable, leak-tight O-ring seal for vacuum or pressure systems
Commonly used for sampling systems, laboratory instruments, instrument calibration, portable test equipment